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The
1st
QFN / DFN Packaging & Test service provider in China
.
Recognized by State Four-Ministry Council as one of the very 1st group of
IC
manufacturers in China.
QFN
Q
uad
F
lat
N
o- Lead Package
方形扁平式无引脚封装
Advantage:
thinner / smaller
Low thermal resistance
Low Inductance
Applications:
Excellent choice for many of the new generation devices, especially for mobile phones, WiFi, PDA’s and Bluetooth™ where size, weight and package performance is required.
COL-QFN Chip On Lead QFN Package:
COL biggest advantage a larger die to be assembled in the same package
Availability
Bill of Material
Package Performance
Package Portfolio 产品规格
Package body size range:
QFN (3x3mm
2
to 8x8mm
2
)
DFN (1.0x0.6mm
2
to 2x5mm
2
)
Package profile thickness
W – 0.75 +/- 0.05mm, UT – max 0.6mm
X1 – max 0.5mm, X2 – max 0.4mm
Lead finish (Plating):
NiPdAu
Matte pure tin
QFN
DFN
COL